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Effect of Pressure on the Performance of Organic Light Emitting Devices Fabricated by Cold Welding

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Description

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Abstract

Analytical and finite element models were used to simulate additive cold welding patterning processes. The effects of adhesion, pressure, thin film (layer) thickness and dust particle modulus (between the contacting surfaces) are examined.

A simple model is developed and used to determine the contact profiles around impurities between cold-welded thin films. These are computed as a function of adhesion, particle modulus, and layer thickness.

The models are shown to provide new insights into the significance of adhesion, layer thickness and particle modulus in the surface contacts that occur during cold welding.

The implications of the results are then discussed for the design and fabrication organic electronics via cold welding.

Introduction

Light-emitting diodes (LEDs) are optoelectronic devices that generate light when they are electronically biased in the forward direction.

The early commercial LEDs devices, in 1960s, were based on inorganic semiconductors such as gallium arsenide phosphide (GaAsP) as an emitter and their efficiencies were very low.

After 40 years of development, the efficiencies of inorganic LEDs have been significantly improved and they are used in a wide range of applications such as telecommunications, indicator lights, and more recently in solid-state lighting.

The applications of LEDs have been very limited for flat panel displays. High-resolution pixelated LED arrays are very expensive to fabricate and the application of LEDs in displays has been limited to bill board displays

where individual LEDs are manually mounted on the display boards. The light-emitting diodes that are made with organic materials are called organic light emitting diodes (OLEDs).

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